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Home Networking Servers & Storage Supermicro BigTwin SYS-222BT-HNC8R 2U 4-Node Server

Supermicro BigTwin SYS-222BT-HNC8R 2U 4-Node Server

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2U 4-node Supermicro BigTwin server platform designed for dense enterprise computing, all-flash hyperconverged infrastructure, container workloads, application acceleration and diskless HPC clusters. Each node supports dual Intel Xeon 6700/6500 series processors, 16 DDR5 DIMM slots and up to 4TB DDR5-6400 memory, combining high compute density with flexible expansion and storage options.

OVERVIEW

  • The Supermicro SYS-222BT-HNC8R is a 2U BigTwin platform containing four hot-pluggable server nodes, giving organizations high compute density within a compact rack footprint. Each node combines dual Intel Xeon 6700/6500 series processor support, 16 DDR5 DIMM slots and up to 4TB DDR5-6400 ECC RDIMM capacity for virtualization, HPC, containerized applications and demanding enterprise workloads. Unlike less-dense single-node rack platforms, its four-node 2U architecture emphasizes compute density, while the six front hot-swap 2.5-inch NVMe/SAS bays per node and PCIe 5.0 expansion provide flexible storage and accelerator connectivity. OCP 3.0-compatible AIOM networking, redundant Titanium-level power supplies and optional liquid cooling further support data-center modernization and high-density deployments.

USE CASES

  • Virtualization clusters requiring dense multi-node compute infrastructure
  • All-flash hyperconverged infrastructure deployments
  • Diskless high-performance computing clusters
  • Container-as-a-Service environments
  • Application acceleration platforms
  • Enterprise private cloud and hybrid cloud infrastructure
  • High-density data center compute consolidation
  • Memory-intensive analytics and enterprise application workloads
  • Research, engineering and technical computing environments
  • Infrastructure modernization projects requiring scalable multi-node compute density

KEY FEATURES

  • 2U chassis integrates four hot-pluggable server nodes
  • Dual Socket E2 LGA-4710 processor architecture per node
  • Supports Intel Xeon 6700/6500 series processors
  • Up to 16 DDR5 DIMM slots per node
  • Supports up to 4TB ECC DDR5-6400 RDIMM per node
  • Six front hot-swap 2.5-inch NVMe/SAS drive bays per node
  • Two PCIe 5.0 x16 low-profile expansion slots per node
  • PCIe 5.0 x16 OCP 3.0-compatible AIOM slot per node
  • Two PCIe 5.0 x4 M.2 NVMe slots per node
  • Optional M.2 hardware RAID1 capability
  • 12Gbps SAS connectivity through Broadcom 3808 in IT mode
  • Dedicated 1GbE RJ45 BMC management port per node
  • TPM 2.0 and Silicon Root of Trust security architecture
  • Secure Boot, signed firmware and secure firmware update capabilities
  • Redundant 2x 3600W Titanium-level power supply configuration

TECHNICAL SPECIFICATIONS

  • Brand: Supermicro
  • Part Number: SYS-222BT-HNC8R
  • Product Family: BigTwin
  • Form Factor: 2U Rackmount
  • Node Configuration: 4 hot-pluggable systems
  • Motherboard: Super X14DBT-B
  • Processor Socket: Dual Socket E2 (LGA-4710) per node
  • Processor Support: Intel Xeon 6700/6500 series
  • Memory Slots: 16 DIMM slots per node
  • Maximum Memory: Up to 4TB DDR5-6400 ECC RDIMM per node
  • Storage Bays: 6 front hot-swap 2.5-inch NVMe/SAS bays per node
  • M.2 Storage: 2 M.2 PCIe 5.0 x4 NVMe slots per node
  • Expansion: 2 PCIe 5.0 x16 LP slots per node
  • Networking Expansion: 1 PCIe 5.0 x16 AIOM slot, OCP 3.0 compatible
  • SAS: 12Gbps via Broadcom 3808, IT mode
  • Management LAN: 1 RJ45 1GbE dedicated BMC port per node
  • USB: 2 USB 3.0 Gen2 Type-A ports per node
  • Video: 1 VGA port per node
  • Security: TPM 2.0, Silicon Root of Trust, Secure Boot
  • Power Supply: 2x 3600W redundant 1+1 Titanium-level, 96%
  • Chassis Dimensions: 449 x 88 x 730mm
  • Operating Temperature: 10°C to 35°C
  • Operating Relative Humidity: 8% to 80%, non-condensing
  • RoHS: Compliant

Why Choose This Product?

  • Organizations choose the SYS-222BT-HNC8R when rack density, compute scalability and node-level flexibility matter more than a conventional single-server design. Four hot-pluggable nodes in a 2U chassis provide a strong density advantage, while dual Intel Xeon 6 processor support and up to 4TB DDR5 memory per node accommodate demanding virtualization, HPC, HCI and container workloads. Six hot-swap NVMe/SAS bays, PCIe 5.0 expansion and OCP 3.0 networking also give buyers more configuration flexibility than a narrowly optimized compute platform. Redundant Titanium-level power supplies, enterprise security controls and optional liquid cooling support longer-term data-center deployment planning. For procurement teams, the platform is particularly compelling when consolidating multiple workloads into a dense architecture while retaining node-level expansion and lifecycle flexibility.

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