Supermicro BigTwin 2U 4-Node Xeon 6 Server

• Hyperconverged infrastructure clusters requiring dense independent compute nodes
• Scale-out file storage deployments using NVMe or SAS storage
• Backup repositories supporting enterprise data protection and recovery strategies
• Disaster recovery infrastructure requiring multiple compact server nodes
• Virtualization clusters consolidating workloads within a space-efficient rack architecture
• Private-cloud environments requiring scalable compute and networking resources
• Enterprise storage platforms using integrated Broadcom SAS3 connectivity
• Infrastructure modernization projects replacing legacy multi-node rack deployments
• Data-center environments where rack density and power efficiency influence procurement decisions
• Branch, service-provider, research, and enterprise deployments requiring compact scale-out infrastructure

• Four hot-pluggable server nodes integrated into a 2U rackmount chassis
• Dual Socket E2 LGA-4710 processor architecture per node
• Supports Intel Xeon 6700/6500 series processors with P-cores
• Supports Intel Xeon 6700 series processors with E-cores
• Up to 4TB DDR5-6400 ECC RDIMM per node at 1DPC
• 16 DIMM slots per node provide substantial memory expansion capacity
• Three front hot-swap 3.5-inch NVMe/SAS bays per node
• Two PCIe 5.0 x16 low-profile expansion slots per node
• PCIe 5.0 x16 AIOM slot provides OCP 3.0-compatible networking expansion
• Two onboard M.2 PCIe 5.0 x4 NVMe slots support high-speed internal storage
• Built-in Broadcom 3808 SAS3 controller provides 12Gbps SAS connectivity in IT mode
• Single-CPU configurations can retain expansion functionality, subject to drive-support limitations
• Direct-to-chip liquid cooling is available for supported high-TDP processor configurations
• Redundant 3600W Titanium-level power supplies provide 1+1 power redundancy
• TPM 2.0, Silicon Root of Trust, Secure Boot, signed firmware, secure updates, automatic recovery, and remote attestation support enterprise security requirements

• Brand: Supermicro
• Part Number: SYS-622BT-HNC8R
• Product Family: BigTwin
• Form Factor: 2U rackmount
• Node Configuration: 4 hot-pluggable nodes
• Motherboard: X14DBT-B
• Processor Socket: Dual Socket E2 (LGA-4710) per node
• Processor Support: Intel Xeon 6700/6500 series with P-cores; Intel Xeon 6700 series with E-cores
• P-Core Capability: Up to 86 cores / 172 threads; up to 366MB cache per CPU
• E-Core Capability: Up to 144 cores / 144 threads; up to 108MB cache per CPU
• Memory Slots: 16 DIMM slots per node
• Maximum Memory: Up to 4TB DDR5-6400 ECC RDIMM per node at 1DPC
• Storage Bays: 3 front hot-swap 3.5-inch NVMe/SAS bays per node
• Storage Configuration: 2 PCIe 5.0 NVMe/SAS + 1 PCIe 4.0 NVMe/SAS bay per node
• M.2 Storage: 2 M.2 PCIe 5.0 x4 NVMe slots per node
• SAS Controller: Broadcom 3808 SAS3, 12Gbps, IT mode
• Expansion Slots: 2 PCIe 5.0 x16 low-profile slots per node
• Network Expansion: 1 PCIe 5.0 x16 AIOM slot per node, OCP 3.0 compatible
• Management LAN: 1 RJ45 1GbE dedicated BMC LAN port per node
• USB: 2 USB 3.0 Type-A rear ports per node
• Video: 1 VGA port per node
• Cooling: 4 heavy-duty 14.9K RPM 80 x 80 x 38 mm fans
• Liquid Cooling: Direct-to-chip cold plate support
• Power Supply: 2 x 3600W redundant 1+1 Titanium-level power supplies
• Power Efficiency: 96%
• Chassis: CSE-827BQ2-R3K60P
• Dimensions: 449 x 88 x 774 mm
• Operating Temperature: 10°C to 35°C
• Operating Relative Humidity: 8% to 80%, non-condensing
• Operating System Support: Windows, Linux, VMware and later versions
• Security: TPM 2.0, Silicon Root of Trust, NIST 800-193 compliance, Secure Boot, cryptographically signed firmware, secure firmware updates, automatic firmware recovery, remote attestation

Why Choose This Product?

• Organizations choose the SYS-622BT-HNC8R when rack density, independent node scalability, storage flexibility, and enterprise manageability matter more than a conventional single-server architecture. Four nodes in 2U provide a strong consolidation advantage, while three hot-swap 3.5-inch NVMe/SAS bays per node, Broadcom SAS3, PCIe 5.0 expansion, and OCP 3.0 AIOM networking give infrastructure teams multiple configuration paths. Support for both P-core and E-core Xeon 6 processors allows procurement teams to align node configurations with workload requirements, while redundant 3600W Titanium-level power and optional direct-to-chip liquid cooling support demanding data-center deployments. It is a strong candidate for HCI, scale-out storage, backup, recovery, virtualization, and infrastructure refresh projects where higher node density can reduce rack-space requirements and simplify long-term platform standardization.