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Supermicro AS-2124US-TNRP 2U Ultra A+ Server

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The Supermicro AS-2124US-TNRP is a 2U Ultra A+ dual-socket enterprise server designed for virtualization, cloud computing, high-end enterprise applications, and hyperconverged storage. Its combination of dual AMD EPYC 7002/7003 processor support, 32 DDR4 DIMM slots, up to 8TB ECC DDR4 memory, 24 hot-swap 2.5-inch NVMe bays, PCIe 4.0 expansion, dual 10GbE, dual 10G SFP+, IPMI 2.0, and redundant 1600W Titanium PSUs makes it well suited to high-throughput, memory-intensive and low-latency data center deployments.

OVERVIEW

  • The AS-2124US-TNRP is a 2U Ultra A+ server for organizations needing dense NVMe storage, high memory capacity and dual-socket AMD EPYC compute in a standard rack footprint. Compatibility: AMD EPYC 7002/7003, ECC DDR4 RDIMM/LRDIMM and 2.5-inch NVMe; SAS/SATA requires the optional SAS kit. Compared with AS-2024US-TRT, it prioritizes 24 NVMe bays and low-latency storage density. 

USE CASES

  • High-density NVMe storage: 24 front hot-swap 2.5-inch NVMe bays provide substantial local flash capacity and high-speed storage density for demanding applications. 
  • Virtualization clusters: Dual AMD EPYC sockets and 32 DIMM slots provide the compute and memory scalability needed for dense virtual-machine consolidation.
  • Private and hybrid cloud: Large memory capacity, high-speed networking and PCIe 4.0 expansion support scalable cloud infrastructure nodes.
  • Hyperconverged infrastructure: Combines dual-socket compute, high memory capacity and dense NVMe storage in a 2U platform, reducing the need for separate compute and storage hardware.
  • Low-latency financial workloads: The 24-NVMe design is suited to storage-intensive environments where fast local data access is important. Supermicro specifically identifies low-latency financial applications for this platform family. 
  • Enterprise databases: Up to 8TB of ECC DDR4 memory and dense NVMe storage provide a strong infrastructure foundation for memory-intensive and storage-intensive databases.
  • Data-intensive application clusters: Dual 10GbE and dual 10G SFP+ connectivity provide multiple high-bandwidth network interfaces for cluster and application traffic. 
  • Enterprise compute nodes: Dual AMD EPYC processors and PCIe 4.0 expansion allow the platform to serve as a scalable compute node for demanding enterprise workloads.

KEY FEATURES

  • Dual AMD EPYC 7002/7003 processor support: Provides two Socket SP3 CPU positions, allowing buyers to deploy dual-socket compute configurations for demanding enterprise workloads. 
  • Up to 8TB ECC DDR4 memory: Supports up to 8TB of 3200MT/s ECC DDR4 RDIMM/LRDIMM across 32 DIMM slots, giving memory-intensive applications significant expansion headroom. 
  • 24 hot-swap 2.5-inch NVMe bays: Delivers exceptionally dense front-access NVMe storage in a 2U chassis, helping organizations maximize high-speed local storage capacity per rack unit. 
  • Optional 24-drive SAS/SATA configuration: Provides an alternative storage architecture when capacity-oriented SAS/SATA drives are preferred; additional controller and cabling requirements may apply. 
  • PCIe 4.0 x16 expansion: Provides a high-bandwidth expansion interface for supported networking, storage or other PCIe devices. 
  • Dual 10GbE RJ45 ports: Provides high-speed Ethernet connectivity for application, cluster and data center networking without requiring an additional network adapter for these ports. 
  • Dual 10GbE SFP+ ports: Adds optical/DAC-oriented 10GbE connectivity options, giving network architects greater flexibility when integrating the server into high-speed infrastructure. 
  • IPMI 2.0 with KVM-over-LAN: Enables remote server administration, virtual media access and out-of-band management, helping reduce on-site maintenance requirements. 
  • TPM 2.0 and Silicon Root of Trust: Provides hardware-based security capabilities, signed firmware, Secure Boot, secure firmware updates and automatic firmware recovery for stronger platform protection. 

TECHNICAL SPECIFICATIONS

  • Brand: Supermicro
  • Product SKU: AS-2124US-TNRP
  • Product Family: Supermicro Ultra A+
  • System Type: 2U Ultra Server
  • Motherboard: Super H12DSU-iN
  • Chassis: CSE-829U2TS-R1K62P3-T
  • Form Factor: 2U rackmount
  • Processor Architecture: AMD EPYC
  • CPU Socket: Dual Socket SP3
  • Processor Support: AMD EPYC 7002/7003 Series
  • Maximum CPU TDP: Up to 280W per CPU, air cooled
  • Memory Slots: 32 DIMM slots
  • Memory Type: ECC DDR4 RDIMM/LRDIMM
  • Maximum Memory: Up to 8TB, 3200MT/s
  • Memory Voltage: 1.2V
  • Standard Storage: 24 × front hot-swap 2.5-inch NVMe bays
  • Alternative Storage: Up to 24 × 2.5-inch SAS/SATA with optional SAS kit
  • Expansion: 1 × PCIe 4.0 x16 FH, 9.5-inch-long slot
  • Additional Expansion: Additional PCIe slots may be available with the 24-SAS-kit solution; configuration-dependent
  • Network: 2 × RJ45 10GbE + 2 × SFP+ 10GbE
  • Dedicated Management LAN: 1 × RJ45 1GbE BMC LAN
  • USB: 2 × USB 3.0 rear + 1 × USB 3.0 Type-A
  • Video: 2 × VGA
  • SATA DOM: 2 × SATA DOM ports
  • TPM: 1 × TPM header; TPM 2.0 supported
  • BMC / IPMI: IPMI 2.0; KVM-over-LAN; virtual media over LAN
  • BIOS: AMI 32MB SPI Flash EEPROM
  • Security TPM 2.0, Silicon Root of Trust, Secure Boot, signed firmware, secure firmware updates, automatic firmware recovery
  • Cooling: Up to 4 heavy-duty PWM fans
  • Power Supply: 2 × 1600W redundant, 1+1
  • PSU Efficiency: Titanium level, 96%
  • Dimensions: 437 × 89 × 723 mm

Why Choose This Product?

  • Exceptional storage density: 24 hot-swap NVMe bays put high-speed flash storage capacity into only 2U, making rack-space utilization a major advantage.
  • Large memory ceiling: Up to 8TB ECC DDR4 across 32 DIMMs provides substantial room for virtualized, database and memory-intensive workloads.
  • Dual-socket AMD EPYC platform: Two SP3 sockets provide a scalable compute architecture for organizations that need more processing capacity within the same rack footprint.
  • High-speed networking built in: Dual 10GbE RJ45 plus dual 10GbE SFP+ interfaces give infrastructure teams multiple 10GbE connectivity choices.
  • Enterprise resilience: Redundant 1600W Titanium-level power supplies and monitored PWM cooling support continuous data center operation.
  • Hardware-level security: TPM 2.0, Silicon Root of Trust, Secure Boot and signed firmware provide a stronger foundation for enterprise infrastructure security. 
  • Remote administration: IPMI 2.0 with KVM-over-LAN and virtual media allows administrators to manage systems remotely, reducing physical intervention.
  • Deployment flexibility: Buyers can choose between the standard 24-NVMe configuration and an optional SAS/SATA architecture depending on performance, capacity and storage-cost priorities. 

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