HPE XL230k Gen10 Xeon Platinum 8160F Front Processor Kit

• High-performance computing clusters.
• Scientific and engineering workloads.
• Parallel compute environments.
• Technical simulation workloads.
• Research computing infrastructure.
• Clustered analytics applications.
• XL230k Gen10 compute-node upgrades.
• HPC infrastructure modernization.
• Data-center compute consolidation.
• Front-processor replacement requirements.

• Intel Xeon Platinum 8160F processor.
• 24 physical processing cores.
• 48 processing threads.
• 2.10GHz processor base frequency.
• 33MB L3 cache.
• 160W thermal design power.
• Intel Xeon Scalable processor family.
• Integrated Intel Omni-Path Architecture.
• Designed for HPE XL230k Gen10 systems.
• Front processor kit configuration.
• Suited to high-performance computing environments.
• Supports highly parallel workloads.
• Suitable for clustered compute infrastructure.
• Useful for targeted processor replacement.
• Factory-installable HPE configuration option. 

• Brand: HPE
• Part Number: 873040-B22
• Product Family: HPE XL230k Gen10
• Processor: Intel Xeon Platinum 8160F
• Processor Cores: 24
• Processor Threads: 48
• Processor Base Frequency: 2.10GHz
• Maximum Turbo Frequency: 3.70GHz
• L3 Cache: 33MB
• Thermal Design Power: 160W
• Processor Socket: FCLGA3647
• Processor Family: Intel Xeon Scalable
• Processor Architecture: Skylake
• Processor Lithography: 14nm
• Processor Position: Front
• Integrated Interconnect: Intel Omni-Path Architecture
• Product Type: Front Processor Kit 

WHY CHOOSE THIS PRODUCT?

• HPE 873040-B22 is a focused choice for organizations operating compatible XL230k Gen10 compute nodes and requiring a front-position Xeon Platinum 8160F processor. Its 24 cores, 48 threads and integrated Omni-Path Architecture make it more specifically positioned for HPC and clustered computing than a conventional processor configuration. HPE’s separate front and rear kit design also supports configuration-specific procurement, but buyers should confirm the node, processor position, thermal requirements and overall system configuration before purchase.