HPE XL1x0r Gen10 Server Xeon Platinum 8158 FIO CPU Kit

• Enterprise application workloads
• Virtualization and server consolidation
• High-performance computing
• Engineering and simulation
• Data analytics and processing
• Scientific and research workloads
• Technical application hosting
• Enterprise compute infrastructure

• Intel Xeon Platinum 8158 processor
• 12 CPU cores
• 24 CPU threads
• 3.0 GHz base frequency
• Up to 3.7 GHz turbo frequency
• 24.75 MB cache
• 150W processor TDP
• Intel Xeon Scalable processor family
• FCLGA3647 socket
• DDR4 memory support
• Factory Integrated Option configuration
• Designed for compatible XL1x0r Gen10 systems
• Suitable for demanding compute workloads

• Brand: HPE
• Part Number: 879567-L21
• Product Family: HPE XL1x0r Gen10
• Product Type: FIO CPU Kit
• Processor: Intel Xeon Platinum 8158
• Processor Family: Intel Xeon Platinum
• Processor Generation: 1st Generation Intel Xeon Scalable
• Processor Cores: 12
• Processor Threads: 24
• Base Frequency: 3.0 GHz
• Maximum Turbo Frequency: 3.7 GHz
• Processor Cache: 24.75 MB
• Processor TDP: 150W
• Processor Socket: FCLGA3647
• Processor Lithography: 14 nm
• Memory Type: DDR4
• Memory Channels: Hexa-channel
• PCI Express Version: 3.0
• Maximum PCI Express Lanes: 48
• UPI Speed: 10.4 GT/s
• Scalability: 2S
• Configuration Type: Factory Integrated Option
• Compatible Platform: HPE XL1x0r Gen10

WHY CHOOSE THIS PRODUCT?

• HPE 879567-L21 is a practical choice for organizations specifying an Intel Xeon Platinum 8158 configuration for compatible XL1x0r Gen10 systems. The 12-core architecture provides substantial parallel processing capacity, while the 3.0 GHz base frequency supports workloads that need a balanced mix of core count and processing responsiveness. Its FIO configuration is particularly relevant to new system procurement and standardized data-center builds, helping organizations align processor selection with planned infrastructure requirements. Buyers should verify the target XL1x0r Gen10 configuration, supported processor combinations, memory population, cooling, and power requirements before procurement.