HPE ProLiant ML350 Gen10 Intel Xeon Platinum 8153 FIO | 878654-L21

• Brand: HPE
• Product Family: HPE ProLiant ML350 Gen10
• SKU: 878654-L21
• HPE Configuration: Intel Xeon Platinum 8153 FIO Processor Kit
• Processor: Intel Xeon Platinum 8153
• Processor Family: Intel Xeon Scalable
• Processor Generation: 1st Generation Intel Xeon Scalable
• Processor Cores: 16
• Processor Threads: 32
• Base Frequency: 2.00 GHz
• Maximum Turbo Frequency: 2.80 GHz
• L3 Cache: 22 MB
• Processor TDP: 125 W
• Lithography: 14 nm
• Memory Type: DDR4
• Maximum Memory Speed: DDR4-2666
• Maximum Memory Capacity: 768 GB
• Memory Channels: 6
• ECC Memory Support: Yes
• PCI Express Revision: PCIe 3.0
• Maximum PCIe Lanes: 48
• Maximum UPI Links: 3
• Processor Socket: FCLGA3647
• Hyper-Threading: Yes
• Intel Turbo Boost Technology: Yes
• Intel VT-x: Yes
• Intel VT-d: Yes
• Intel Trusted Execution Technology: Yes
• Intel AES New Instructions: Yes
• Instruction Extensions: SSE4.2, AVX, AVX2, AVX-512
• AVX-512 FMA Units: 2
• Intel Speed Shift: Yes
• Intel VMD: Yes
• Intel Optane Memory Support: No
• Platform Compatibility: HPE ProLiant ML350 Gen10
• Compatibility: Supported ML350 Gen10 configuration
• RAM: No RAM
• HDD / Storage: No HDD
• Power Supply: No PSU
• Configuration Type: FIO
• Processor Status: Discontinued
• Launch Date: Q3 2017

Why Choose This Product?

• 16-core processing capacity - Provides a practical balance between compute density and infrastructure cost for enterprise workloads.
• 32 processing threads - Supports simultaneous execution across compatible applications and virtual machines.
• DDR4-2666 ECC support - Enables enterprise memory configurations designed for data integrity and reliability.
• Up to 768 GB memory support - Gives infrastructure teams room to scale memory for virtualization and data-intensive applications.
• 48 PCIe 3.0 lanes - Provides useful expansion capacity for supported storage, networking and I/O adapters.
• 125 W processor TDP - Helps IT teams plan thermal and power requirements around a defined CPU power envelope.
• No-RAM configuration - Avoids forcing a fixed memory configuration and allows procurement to match DIMMs to actual workload requirements.
• No-HDD and no-PSU configuration - Gives buyers greater control over storage capacity, drive technology, power-supply sizing and redundancy.