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Home Networking Network Switches Network Switch Accessories Extreme Networks Summit X670 Fan Module %u2013 Hot-Swappable Front-to-Back Airflow

Extreme Networks Summit X670 Fan Module %u2013 Hot-Swappable Front-to-Back Airflow

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The Extreme Networks Summit X670 Fan Module is a reliable hot-swappable cooling accessory designed for X670 Series switches. It provides efficient front-to-back airflow management to support stable network performance, improved thermal control, and enterprise-grade reliability in demanding B2B networking environments.

OVERVIEW

  • The Extreme Networks Summit X670 Fan Module is a purpose-built cooling accessory for Extreme Networks X670 Series switches. Designed for enterprise networking environments, this hot-swappable fan module enables quick replacement without extended network downtime. Its front-to-back airflow design helps maintain optimized thermal performance, making it suitable for data centers, campus networks, and high-availability IT infrastructures.
  • Reliable cooling is essential for maintaining switch efficiency and operational stability. This fan module supports consistent airflow management, helping network administrators maintain dependable performance across mission-critical deployments.

USE CASES

  • Enterprise Data Centers: Supports continuous cooling requirements for high-performance switching environments where uptime and reliability are critical.
  • Campus Network Infrastructure: Helps maintain stable operating temperatures for large-scale enterprise and educational network deployments.
  • Network Hardware Maintenance: Provides a convenient replacement solution for IT teams managing Extreme Networks X670 Series switches.

KEY FEATURES

  • Compatible with Extreme Networks Summit X670 Series switches
  • Hot-swappable fan module design for simplified maintenance
  • Front-to-back airflow configuration for efficient cooling management
  • Supports reliable thermal control in enterprise networks
  • Helps reduce overheating risks in high-density switching environments
  • Designed for professional IT infrastructure deployments
  • Ideal replacement accessory for X670 Series networking equipment 

TECHNICAL SPECIFICATIONS

  • Brand: Extreme 
  • Product Category: Switch Cooling Accessory / Replacement Fan Module
  • Manufacturer: Extreme Networks
  • Product Family: Summit X670 Series
  • Accessory Type: Cooling Fan Module
  • Compatible Devices: Extreme Networks Summit X670 Series Switches
  • Installation Method: Tool-less Hot-Swap Installation
  • Replacement Type: Field Replaceable Unit (FRU)
  • Airflow Design: Front-to-Back Airflow
  • Cooling Function: Internal Switch Thermal Management
  • Operating Purpose: Maintains optimal switch temperature and airflow circulation
  • Deployment Environment: Enterprise Networks, Data Centers, Campus Networks
  • Maintenance Impact: Allows fan replacement without extended service interruption
  • Cooling Architecture: Active Fan-Based Cooling System
  • Hardware Integration: Designed for seamless integration with X670 Series chassis
  • Reliability Feature: Supports continuous network operation through efficient heat dissipation

WHY CHOOSE THE MODEL?

  • The Extreme Networks Summit X670 Fan Module delivers dependable cooling performance and easy maintenance for enterprise switching environments. Its hot-swappable design helps reduce downtime during hardware servicing, while front-to-back airflow supports efficient thermal management.

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